Comprehensive hardware engineering, mechanical co-design, and production oversight.
Technical roadmap definition, system requirements, FPGA vs. MCU trade-off evaluations, and complete hardware block diagram engineering from concept to approval.
Custom RF front-ends (433MHz–5.8GHz), antenna layout, power amplifiers (+40dBm), transceivers, VNA S-parameter tuning, and protocol implementation (LoRa, BT, ZigBee).
3D CAD physical integration (Fusion 360), high-density flex-rigid board constraints, thermal management, and body-worn/compact device physical modeling.
On-the-ground management in China & Hong Kong. DFM/DFT compliance, PCB fabricator selection, component sourcing, SMT line auditing, and yield optimization.