Bridging high-frequency RF engineering, high-speed digital architecture, mechanical integration, and high-volume manufacturing in Asia.
Full lifecycle RF architecture (433MHz–5.8GHz), antenna tuning, SI/PI simulation, and high-speed digital interconnects.
3D enclosure co-design, rigid-flex PCB constraints, thermal optimization, and dynamic CAD mapping.
On-the-ground SCM in China & Hong Kong, vendor management, DFM/DFT implementation, and production testing.